|
FR4 1-38 Layer PCB;low price pcb manufacturer;Pcb Routing;Pcb Cutting Machine;Electronic pcb board;FR4 Double-sided PCB. Cell Phone HDI PCB
We-can-prvide-a-package-of-service:-
-
-·-1.-PCB-layout,-PCB-design;-
·-2:-Make-high-difficulty-PCB(1-to-38-layers)-
·-3:-Provide-all-Electronic-components;-
·-4:-PCB-assembly;--
·-5:-Write-programs-for-clients;--
·-6:-PCBA/finished-product-Test.-
·-etc…
Specification-for-PCB-Manufacture:
Item | Specification |
Numbr-of-Layer | 1-38Layers |
Material | FR-4,FR2.Taconic,Rogers,-CEM-1-CEM-3,ceramic-,-crockery |
Metal-backed-Laminate | |
Remarks | High-Tg-CCL-Is-Availabe(Tg>=170ºC) |
Finish-Board-Thickness | 0.2mm-6.00-mm(8mil-126mil) |
Minimun-Core-Thickness | 0.075mm(3mil) |
Copper-Thickness | 1/2-oz-min;12-oz-max |
Min.Trace-Width-&-Line-Spacing | 0.075mm/0.1mm(3mil/4mil) |
Min.Hole-Diameter-for-CNC-Driling | 0.1mm(4mil) |
Min.Hole-Diameter-for-punching | 0.9mm(35mil) |
Biggest-panel-size | 610mm*508mm |
Hole-Positon | +/-0.075mm(3mil)-CNC-Driling |
Conductor-Width(W) | +/-0.05mm(2mil)or |
+/-20%-of-original-artwork | |
Hole-Diameter(H) | PTH-L:+/-0.075mm(3mil) |
Non-PTH-L:+/-0.05mm(2mil) | |
Outline-Tolerance | +/-0.125mm(5mil)-CNC-Routing |
+/-0.15mm(6mil)-by-Punching | |
Warp-&-Twist | 0.70% |
Insulation-Resistance | 10Kohm-20Mohm |
Conductivity | <50ohm |
Test-Voltage | 10-300V |
Panel-Size | 110×100mm(min) |
660×600mm(max) | |
Layer-layer-misregistration | 4-layers:0.15mm(6mil)max |
6-layers:0.25mm(10mil)max | |
Min.spacing-between-hole-edge-to-circuity-pqttern-of-an-inner-layer | 0.25mm(10mil) |
Min.spacing-between-board-oulineto-circuitry-pattern-of-an-inner-layer | 0.25mm(10mil) |
Board-thickness-tolerance | 4-layers:+/-0.13mm(5mil) |
6-layers:+/-0.15mm(6mil) | |
Impedance-Control | +/-10% |
Different-Impendance | +-/10% |
-
Detailed terms for PCB Assembly
Technical requirement
1)Professional surface-mounting and Through-hole soldering technology
2)Various sizes like 1206,0805,0603 components SMT technology
3)ICT (In Circuit Test),FCT (Functional Circuit Test ) technology
4)PCB Assembly with VL.CE.FCC.Rohs Approval
5)Nitrogen gas reflow soldering technology for SMT
6)High standard SMT&Solder Assembly Line
7)High density interconnected board place ment technology capacity-----
Quote requirement
1)genber file and Bom list
2)clear pics of PCBA or PCBA Sample for us
3)Test Method for PCBA
-
Our majoy customers:
![]() |
Cell Phone HDI PCB Images |